Two Chinese Printing-Related Innovation Patents Published

Two Chinese Printing-Related Innovation Patents Published

The China National Intellectual Property Administration has recently published patent information on two printing-related innovations from Huqiu Imaging and Huawei Technologies.

Huqiu Imaging (Suzhou) Co., Ltd. has been granted a patent for an anti-adhesion sheet and printer, with the authorization announcement number CN 222647880 U, filed in March 2024. The patent introduces a mechanism to prevent multiple film sheets from sticking together during output. The system consists of an anti-adhesion sheet installed within the cartridge, featuring a smooth side that guides the film and a rough side that generates friction. When two sheets adhere to each other, an external force moves them toward the smooth surface, allowing them to glide forward. Upon contact with the rough surface, the friction helps separate the sheets, ensuring that only a single sheet is fed at a time.

Meanwhile, Huawei Technologies Co., Ltd. has applied for a patent related to a fixing device and printer, published under application number CN 119668063 A, with a filing date of September 2023. The patent describes a fixing unit comprising a heating roller, a pressure roller, and a compensation roller. The heating roller rotates around its central axis, while the pressure roller applies radial pressure to it. The compensation roller, also in contact with the heating roller, counterbalances this pressure to reduce deformation caused by stress. This design aims to enhance the longevity of the equipment and improve print quality by minimizing distortions in the heating roller.

Related:

• China Printer Manufacturers Make a Splash in Past Month
• Epson Sued for Patent Infringement
• Kilider Recognized in High-Value Patent Cultivation Initiative
• Canon Announces Settlement of Patent Dispute with Aster
• HP Sued for Infringement of Flexiworld Patents

Comment:

Please leave your comment below about the news: Two Chinese Printing-Related Innovation Patents Published.